Flexible Electronic Microfliers
Distributed Spatial Sensing Nodes
- How to design and fabricate microfliers that are lighter, smaller, and stay airborne longer?
- How to achieve active control of microfliers at millimeter and micrometer scales?
Core Scientific Questions
When the substrate is soft, curved, or tumbling through the air,
how do we let it still “sense” the world and coordinate with its peers?
Flexible electronics is, at its heart, a mechanics problem: its electrical function depends on how the structure deforms and is precisely controlled under coupled mechanical, thermal, and electrical fields. Around the core question of “distributed sensing on flexible substrates,” we develop three mutually reinforcing capabilities that together form the sensing infrastructure for Physical AI.
High-Temperature Flexible Multimodal Sensors
Extreme-Environment Structural Monitoring
- How to stably sense pressure, temperature and strain at several hundred degrees Celsius?
- How to make flexible thin-film sensors conformally attach to engine curved surfaces?
Flexible Intelligent Microsystems
Human–Machine–Environment Fusion Terminal
- How to pack sensing, communication and actuation into fibers and soft bodies for human–machine–environment fusion?
- How to move flexible electronics from “can sense” to “can think and act”?
- How can a swarm of microfliers self-organize and emerge with collective intelligence?
Research Architecture
Fig. Research architecture grounded in theoretical and applied mechanics: three mutually reinforcing capability directions and their representative application scenarios for Physical AI.